SPECIFICATIONS

Package Specifications
Max CPU Configuration	1
T_CASE	74.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	82 mm²
# of Processing Die Transistors	228 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	No
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

CPU اینتل Dual Core E 5700